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744678 1
GSD4E-9411-TR
Qualcomm
Quantity
Package
Description
Datasheets
16000
103-BGA (5x7.2)
original&Quality new original
Added
RFQ
744679 1
BC57G687C-ANN-E4
Qualcomm
Quantity
Package
Description
Datasheets
16000
105-LFBGA
original&Quality new original
Added
RFQ
744680 1
BC57G687C-INN-E4
Qualcomm
Quantity
Package
Description
Datasheets
16000
105-LFBGA
original&Quality new original
Added
RFQ
744681 1
CSRB5348A11-IBVE-R
Qualcomm
Quantity
Package
Description
Datasheets
16000
105-VFBGA
original&Quality new original
Added
RFQ
744797 1
CSR8670C-IBBH-R
Qualcomm
Quantity
Package
Description
Datasheets
16000
112-VFBGA
original&Quality new original
Added
RFQ
744798 1
CSR8675C-IBBH-R
Qualcomm
Quantity
Package
Description
Datasheets
16000
112-VFBGA
original&Quality new original
Added
RFQ
744810 1
BC57G687C-GITM-E4
Qualcomm
Quantity
Package
Description
Datasheets
16000
120-LFBGA
original&Quality new original
Added
RFQ
744811 1
BC57H687B-ITM-E4
Qualcomm
Quantity
Package
Description
Datasheets
16000
120-LFBGA
original&Quality new original
Added
RFQ
744812 1
BC57H687C-GITM-E4
Qualcomm
Quantity
Package
Description
Datasheets
16000
120-LFBGA
original&Quality new original
Added
RFQ
744819 1
BC352239A-IVQ-E4
Qualcomm
Quantity
Package
Description
Datasheets
16000
120-VFBGA
original&Quality new original
Added
RFQ
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XC3S200A-4FTG256C
Added
RFQ
[Type]
Description
[Category]
電阻器
片式電阻器 - 表面貼裝
[Brand]
Walsin Technology Corporation
[Qty]
WR
Package
卷帶 (TR)
[Series]
在售
[Product parameter]
容差
±1%
功率 (W)
±1%
成分
厚膜
特性
-
溫度系數
±1%
工作溫度
-55°C ~ 155°C
封裝 / 外殼
0603
封裝 / 外殼
0603
封裝 / 外殼
0603
封裝 / 外殼
0603
Manufacturer
:
XILINX
Part No
:
XCZU2CG-1SBVA484E
Order Code
:
2760177
Product Range
:
Zynq UltraScale+ MPSoC Family
Series
:
MPSoC
[Product Overview]
Part No.
Brand
Description
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